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Molecular-Dynamical Investigation of Thermomechanical Properties of Spherical Solid and Hollow Nickel Nanopowder during Laser Additive Manufacturing Process
Ling-Feng Lai1, Yu-Chen Su2, Chun-Ming Chang3, Kuei-Shu Hsu4, Deng-Maw Lu1 and Jian-Ming Lu5*
1Department of Mechanical Engineering, Southern Taiwan University of Science and Technology, Taiwan
2Department of Civil Engineering, National Central University, Taiwan
3Taiwan Instrument Research Institute, National Applied Research Laboratories, Taiwan
4Department of Recreation and Health Care Management, Chia Nan University of Pharmacy & Science, Taiwan
5National Center for High-Performance Computing, National Applied Research Laboratories, Taiwan
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Abstract:
Molecular dynamics (MD) simulation with the embedded-atom method (EAM)/alloy potential is used to investigate the property of the nanoscale hollow spherical Nickel (Ni) powder during the laser additive manufacturing (AM) process. The thermomechanical properties of the Ni nanopowder is also explored (1) at room temperature and (2) from room temperature to the melting temperature during laser AM of powder bed fusion. As a result, the optimum parameters for the laser AM process are proposed. The optimal coalescence temperature of the nanoscale hollow spherical Ni powder is in the range between 980 and 1421K, while the melting temperature is in the range between 1320 and 1470 K. The coalescence and melting temperatures are lower than the melting point of Ni (1728 K).
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Keywords: molecular dynamics, nanoscale, additive manufacturing, coalescence, melting
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Received:November 03, 2022; Revised:November 28, 2022; Accepted:December 03, 2022; Published:December 30, 2022
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*Corresponding author; e-mail: 0403817@narlabs.org.tw
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Citation:Lai, L.F.; Su, Y.C.; Chang, C.M.; Hsu, K.S.; Lu, D.M.; Lu, J.M.Molecular-Dynamical Investigation of Thermomechanical Properties of Spherical Solid and Hollow Nickel Nanopowder during Laser Additive Manufacturing Process. Applied Functional Materials 2022, 2, 33-40. https://doi.org/10.35745/afm2022v02.04.0005
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Copyright: ©
2022
The Author(s). Published with license by IIKII, Singapore. This is an Open Access article distributed under the terms of the Creative Commons Attribution License (CC BY), which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
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